FS450R12OE4BOSA1

Overview

The FS450R12OE4BOSA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology. It features a 1200 V collector-emitter voltage rating and a continuous collector current of 900 A at 25°C. The module incorporates an emitter-controlled high-speed diode and includes an integrated NTC thermistor for thermal monitoring. Packaged in the EconoPACK+ D-series format with PressFIT contact technology and pre-applied thermal interface material, it supports screw or press-fit mounting. The operating junction temperature range spans from -40°C to +150°C.

Feature Summary

• Six-pack configuration integrating three half-bridge legs with emitter-controlled high-speed diodes for efficient power conversion.
• PressFIT contact technology enables direct board connection without soldering, reducing assembly time and improving mechanical stability.
• Integrated NTC thermistor provides precise real-time junction temperature monitoring for advanced thermal management.
• Pre-applied thermal interface material simplifies heatsink integration and ensures consistent thermal performance.

Applications

• Industrial motor drives and servo systems requiring high current density.
• Uninterruptible power supplies (UPS) and industrial inverters.
• Medium-power renewable energy inverters such as solar or wind converters.

Procurement Notes

Verify the specific suffix BOSA1 against official Infineon documentation to confirm environmental compliance and pinout compatibility. Ensure that the receiving PCB supports PressFIT termination requirements. Confirm that the design accommodates the module's thermal interface specifications and mounting constraints for reliable operation within the specified temperature range.

Selection Notes

Select this module when a six-pack topology is required for three-phase applications. The 1200 V rating suits medium-voltage industrial systems. Consider the 900 A current capacity for high-power density designs. Verify that the system can accommodate the PressFIT mounting method and that the thermal management solution aligns with the module's dissipation characteristics and operating temperature limits.

Part Context

This component belongs to the Trenchstop IGBT4 E4 series, representing an evolution in field-stop technology for improved switching performance. The EconoPACK+ D-series packaging is designed for high-current applications, offering enhanced electrical and thermal performance compared to previous generations. It serves as a key building block for robust power electronics in demanding industrial environments.

Replacement Considerations

Direct substitutes include FS450R12OE4P and FS450R12OE4PBOSA1. These variants share identical electrical characteristics and form factors. Verify that any replacement maintains the same PressFIT contact technology and NTC integration to ensure mechanical and thermal compatibility in existing assemblies.