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The FS450R17OP4PBOSA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology and Emitter Controlled 3 diodes. It features PressFIT connection technology and pre-applied thermal interface material. The collector-emitter voltage (VCES) is rated at 1700 V, with a continuous DC collector current (IC nom) of 450 A at TH = 55°C and a repetitive peak collector current (ICRM) of 900 A. The maximum operating junction temperature (Tvj op) reaches 150°C. Key electrical parameters include a collector-emitter saturation voltage (VCE sat) ranging from 1.70 V to 2.20 V depending on temperature, and a gate threshold voltage (VGEth) between 5.35 V and 6.25 V.
Verify the specific ordering suffix BOSA1 against official documentation to confirm exact manufacturing details or regional compliance variations. Confirm that the required PressFIT tooling is compatible with the module terminals. Ensure the application design accounts for the pre-applied thermal interface material storage and handling requirements as specified in relevant application notes.
Select this module when high short-circuit robustness and mechanical stability are required. The PressFIT technology eliminates soldering steps but requires specific mounting torque specifications. Consider the 150°C maximum junction temperature limit for thermal management calculations. Verify compatibility with existing control systems regarding the integrated NTC thermistor characteristics.
This component belongs to the EconoPACK+ series featuring Trench/Fieldstop IGBT4 technology. It represents an evolution in high-power modules designed for industrial applications requiring high reliability. The integration of Emitter Controlled 3 diodes enhances switching performance compared to standard fast recovery diodes.
FS450R17OE4P
The module supports a short-circuit time (tP) of up to 10 µs under conditions where VGE ≤ 15 V, VCC = 1000 V, and Tvj = 150°C.
Yes, the module includes an integrated NTC temperature sensor with a rated resistance (R25) of 5.00 kΩ at 25°C.
The module utilizes PressFIT contact technology for electrical connections, which is designed for automated assembly without soldering.