FS500R17OE4DB81BPSA1

Overview

The FS500R17OE4DB81BPSA1 is a six-pack IGBT module utilizing Trench/Fieldstop IGBT4 technology and Emitter Controlled 3 diodes. It features PressFIT connection technology and an integrated NTC temperature sensor. The collector-emitter voltage (VCES) is 1700 V, with a continuous DC collector current (ICDC) of 500 A at TC = 95°C and Tvj max = 175°C. The repetitive peak collector current (ICRM) reaches 1000 A for 1 ms pulses. At Tvj = 25°C, the collector-emitter saturation voltage (VCEsat) is typically 1.95 V. The gate threshold voltage (VGEth) is typically 5.80 V, and the internal gate resistor (RGint) is 1.5 Ω. Thermal resistance from junction to case (RthJC) is 0.0500 K/W per IGBT and 0.0840 K/W per diode.

Feature Summary

• High short-circuit capability and surge current robustness
• H2S ruggedness and high mechanical robustness
• Isolated base plate construction
• RoHS compliant manufacturing

Applications

• Auxiliary inverters
• High power converters
• Motor drives
• Wind turbines

Procurement Notes

Verify the specific B81 suffix against official Infineon documentation to confirm exact material and serial number coding requirements. Ensure that the ordering information matches the precise datasheet version referenced during procurement. Confirm compliance with applicable industrial standards before finalizing purchase orders.

Selection Notes

Select this component for applications requiring high short-circuit robustness and H2S tolerance. Verify thermal management capabilities against the specified RthJC values. Ensure the operating junction temperature remains within the -40°C to 150°C range. Confirm compatibility with PressFIT mounting torque specifications for reliable electrical connections.

Part Context

This module belongs to the EconoPACK+ series, designed for high-power industrial applications. It integrates Trench/Fieldstop IGBT4 technology with Emitter Controlled 3 diodes. The PressFIT contact technology eliminates soldering requirements for terminal connections. The isolated base plate enhances safety in electrically demanding environments.

Replacement Considerations

Consult official Infineon cross-reference lists for verified substitutes. Ensure replacement modules maintain identical voltage ratings, current capacities, and thermal characteristics. Verify mechanical footprint compatibility and terminal configuration alignment.