FS770R08A6P2LBBPSA1

FS770R08A6P2LBBPSA1

$276.04
  • Description:FS770R08 - IGBT MODULE
  • Series:*

SKU:97e64836de1c Category: Brand:

  
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Product Detailed Parameters

  • Description:FS770R08 - IGBT MODULE
  • Series:*
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:-
  • Configuration:-
  • Vce(on) (Max) @ Vge, Ic:-
  • Input:-
  • NTC Thermistor:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):-
  • Current - Collector (Ic) (Max):-
  • Power - Max:-
  • Current - Collector Cutoff (Max):-
  • Input Capacitance (Cies) @ Vce:-

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FS770R08A6P2LBBPSA1

Overview

The FS770R08A6P2LBBPSA1 is a HybridPACK Drive six-pack IGBT module with EDT2 technology. It features a 750 V collector-emitter voltage (VCES) and an implemented collector current of 770 A. The continuous DC collector current is 450 A at 75°C baseplate temperature, with a maximum junction temperature of 175°C for short-time extended operation. Key electrical parameters include a saturation voltage of 1.15 V typ. at 450 A and 25°C, and switching losses of 13.5 mJ turn-on and 23.5 mJ turn-off at 450 A/400 V. The module utilizes press-fit signal terminals and includes an integrated NTC thermistor.

Feature Summary

  • EDT2 IGBT generation optimized for electric drive train applications
  • Press-fit contact technology for signal terminals to avoid selective soldering
  • Mechanical guiding elements supporting easy PCB and cooler assembly
  • Direct cooled base plate with ribbon bonds

Applications

  • Hybrid Electrical Vehicles (H)EV
  • Motor Drives
  • Commercial Agriculture Vehicles

Procurement Notes

Verify the specific ordering code SP001706976 against the requested model suffix. Confirm that the flat baseplate configuration matches the system cooling requirements, as this variant differs from PinFin versions in the same family. Ensure compliance with automotive qualification standards required for the target application environment.

Selection Notes

Select this module for traction inverter designs requiring high power density within the 750 V class. The EDT2 chipset offers low light load power losses suitable for real driving cycles. Verify thermal management capabilities for the 175°C extended operating temperature limit, ensuring the baseplate temperature remains below 125°C during such conditions.

Part Context

This component belongs to the Infineon HybridPACK Drive family, designed for hybrid and electric vehicle traction inverters. It represents a derivative within the series featuring a flat baseplate, distinct from PinFin variants like the FS820R08A6P2B. The module integrates Automotive Micro-Pattern Trench-Field-Stop cell design for benchmark current density and short circuit ruggedness.

Replacement Considerations

FS770R08A6P2B

FAQ

What is the maximum short-time extended junction temperature?

The module supports a short-time extended operation temperature (Tvj op) of 175°C.

How does the module handle signal terminal connections?

It utilizes PressFIT contact technology for signal terminals, which avoids additional time-consuming selective solder processes.

What is the stray inductance value of the module?

The module has a low inductive design with a stray inductance (LsCE) of 8.0 nH.

FS770R08A6P2LBBPSA1FS770R08A6P2LBBPSA1
$276.04
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