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The FS820R08A6P2LB is a HybridPACK Drive six-pack power module featuring EDT2 IGBTs and diodes, rated for 750 V collector-emitter voltage and 820 A implemented collector current. It utilizes an automotive Micro-Pattern Trench-Field-Stop cell design optimized for electric drive trains with switching frequencies around 10 kHz. The module includes a direct-cooled PinFin baseplate, press-fit signal terminals, and integrated NTC sensor. Key electrical parameters include a continuous DC collector current of 450 A at 175°C junction temperature, short-circuit ruggedness up to 4800 A, and isolation test voltage of 4.2 kV RMS.
Verify the specific ordering code SP001611366 against official Infineon documentation to ensure correct variant selection. Confirm that the cooling fluid composition matches the datasheet specification of 50% water and 50% ethylene glycol for accurate thermal resistance calculations. Ensure mounting torque specifications for M4 baseplate screws and EJOT Delta PCB screws are strictly followed during assembly to maintain mechanical integrity and thermal performance.
Select this module for applications requiring high power density and robust short-circuit capability in automotive environments. Consider the 10 kHz switching frequency optimization when designing gate driver circuits. Evaluate the thermal management requirements based on the RthJF values provided for both IGBT and diode sections under specified flow conditions. Ensure the system voltage does not exceed the 750 V blocking rating under all operating transients.
This component belongs to the HybridPACK Drive family, designed specifically for compact integration in electric and hybrid vehicle inverters. The FS820R08A6P2LB represents an evolution in EDT2 technology, focusing on reducing switching losses and improving reliability under harsh environmental conditions compared to previous generations.
No public confirmed substitute part numbers are listed in the datasheet. Verify compatibility with existing gate drivers and cooling interfaces if considering alternative modules from other manufacturers or different Infineon series.