FS950R08A6P2LBBPSA1

Overview

The FS950R08A6P2LBBPSA1 is a HybridPACK Drive six-pack IGBT module utilizing EDT2 technology. It features a 750 V collector-emitter voltage and an implemented current of 950 A. The continuous DC collector current is 450 A at a junction temperature of 175°C, with a repetitive peak current of 1900 A. Total power dissipation reaches 870 W. The module incorporates a direct-cooled PinFin baseplate, press-fit signal terminals, and an integrated NTC thermistor (5 kΩ at 25°C). It supports operation up to 175°C and includes mechanical guiding elements for assembly.

Feature Summary

• EDT2 IGBT generation optimized for electric drive train applications
• Direct cooled PinFin baseplate structure for superior thermal characteristics
• Press-fit contact technology for signal terminals to avoid selective soldering
• High clearance and creepage distances supporting modular inverter approaches

Applications

• Hybrid Electrical Vehicles (HEV)
• Electric Vehicles (EV)
• Motor Drives
• Commercial Agriculture Vehicles

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm exact terminal configurations and packaging details. Ensure that the procurement channel provides valid traceability data consistent with automotive quality standards. Cross-reference the part number with the latest datasheet revision to confirm technical specifications before finalizing orders.

Selection Notes

Select this module for traction inverter designs requiring high current density and robust short-circuit ruggedness. The EDT2 chipset offers low switching losses suitable for frequencies around 10 kHz. Consider the direct cooling requirements and the specific mounting torque specifications for the M4 screws when designing the mechanical interface.

Part Context

This component belongs to the Infineon HybridPACK Drive family, designed specifically for automotive traction inverters. It represents a compact six-pack solution integrating IGBTs and diodes on a shared substrate. The series focuses on scalability within a standard footprint, allowing designers to utilize established cooling and PCB layouts across different power ratings.

Replacement Considerations

Consult the official Infineon product selection guide for verified alternative part numbers within the HybridPACK Drive family. Substitutes must match the 750 V rating, 950 A implementation, and compatible package dimensions. Verify that any replacement maintains the required EDT2 technology characteristics and thermal performance metrics.