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FT2232HL-TRAY is listed in the Controllers range at ChipApex. The manufacturer field lists FTDI, Future Technology Devices International Ltd. Its product description is IC USB HS DUAL UART/FIFO 64-LQFP. Review the specifications below when checking this part for your BOM.
The FT2232HL-TRAY is a dual-channel USB-to-UART/FIFO bridge controller manufactured by FTDI. It integrates two independent UART channels and supports USB 2.0 High-Speed data transfer rates up to 480 Mbps. The device operates within a supply voltage range of 3V to 3.6V and draws approximately 70 mA of operating current. It is housed in a 64-pin LQFP package with dimensions of 10x10 mm and a height of 1.6 mm. The component functions reliably across an industrial temperature range from -40°C to +85°C.
Verify the specific suffix against official FTDI documentation to confirm packaging type, as TRAY indicates bulk tray packaging rather than reel or cut tape. Ensure the ordering part number matches the exact electrical and mechanical specifications required for the target application. Cross-reference datasheets to confirm RoHS compliance and lead-free status before finalizing procurement orders.
Select this component when dual-channel USB connectivity with high-speed performance is required. Consider the LQFP-64 package constraints for PCB layout and thermal management. Verify that the host system supports USB 2.0 High-Speed standards. Evaluate the need for external EEPROM configuration if persistent VID/PID storage is necessary for the specific deployment environment.
This component belongs to the FT2232H series, representing FTDI's fifth-generation USB interface technology. It serves as a bridge between USB hosts and various serial protocols, eliminating the need for complex firmware development on the peripheral side. The series is widely recognized for its stability in converting USB signals to UART, FIFO, and other synchronous serial interfaces.
FT2232HQ is a verified alternative within the same family offering similar functionality. Check pinout compatibility and software driver support before substitution. Other variants may differ in package size or thermal characteristics, requiring careful review of mechanical drawings and datasheet parameters.
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