SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The GBJA1010-BP is a single-phase bridge rectifier manufactured by Micro Commercial Components (MCC). It features a glass passivated chip junction and utilizes epoxy meeting UL 94 V-0 flammability ratings. The device supports an average rectified forward current of 10 A at a case temperature of 110°C, with a peak repetitive reverse voltage of 1000 V. Key electrical parameters include a maximum reverse current of 5 µA at 25°C and 200 µA at 125°C, a typical forward voltage of 1.0 V at 5 A, and a non-repetitive peak surge current of 150 A for an 8.3 ms half sine wave. The component operates within a junction temperature range of -55°C to +150°C.
Verify authenticity by purchasing directly from MCC or authorized distributors to avoid counterfeit components. Ensure the ordering suffix matches the required packaging configuration. Confirm RoHS compliance status if environmental regulations apply to the specific manufacturing batch. Check for any recent product change notifications regarding material composition or marking codes before finalizing procurement orders.
Select this component when a 1000 V peak repetitive reverse voltage rating is required for single-phase bridge applications. Verify that the thermal management design accommodates the specified thermal resistance values for both junction-to-case and junction-to-ambient conditions. Ensure the operating environment stays within the -55°C to +150°C junction temperature range. Consider the physical dimensions of the JA-4 package for PCB layout constraints.
This part belongs to the GBJA10005 through GBJA1010 series, which offers varying reverse voltage ratings from 50 V to 1000 V while maintaining a consistent 10 A forward current capacity. The 'JA' designation indicates the specific package style used for these high-voltage variants. The series shares common mechanical and thermal characteristics across all voltage ratings within the family.
Direct replacements must match the 10 A current rating, 1000 V reverse voltage, and JA-4 package footprint. Verify that substitute components meet the same thermal resistance and forward voltage specifications. Ensure the replacement also utilizes glass passivation if reliability under high-temperature conditions is critical.