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The GBPC1202-E4/51 is a glass passivated single-phase bridge rectifier from Vishay General Semiconductor. It provides a maximum average forward rectified output current of 12 A and supports a maximum repetitive peak reverse voltage of 200 V. The device features a peak forward surge current capability of 200 A and a typical junction capacitance of 160 pF per diode. Operating within a temperature range of -55 °C to +150 °C, it exhibits a maximum instantaneous forward drop of 1.1 V at 6.0 A and a maximum reverse DC current of 5 μA at rated blocking voltage.
Verify component authenticity by cross-referencing the manufacturer part number with official Vishay documentation. Confirm that the E4 suffix indicates RoHS compliance and the /51 code matches the specified paper box packaging format. Ensure technical specifications align with the intended circuit requirements before finalizing acquisition.
Select this component when a 12 A continuous current rating and 200 V reverse voltage are required. Verify thermal management needs based on the 1.9 °C/W junction-to-case thermal resistance. Consider the 200 A non-repetitive surge current limit for inrush protection. Ensure the operating environment stays within the -55 °C to +150 °C junction temperature range.
This component belongs to the GBPC series of single-phase bridge rectifiers manufactured by Vishay General Semiconductor. The series includes variants with different current ratings (12 A, 15 A, 25 A, 35 A) and voltage ratings (50 V to 1000 V). The GBPC1202 specifically denotes the 12 A current class and 200 V voltage class within this standardized product family.
Compatible substitutes include other Vishay GBPC12xx-E4/51 variants with matching voltage ratings, such as GBPC1204-E4/51 or GBPC1206-E4/51. Cross-manufacturer replacements must match the 12 A current, 200 V reverse voltage, and GBPC package dimensions to ensure physical and electrical compatibility.
The maximum RMS isolation voltage from the case to the leads is 2500 V.
Polarity is marked on the component, with the positive lead identified by a beveled corner.
The maximum allowable solder dip temperature is 275 °C for a duration of 10 seconds, per JESD 22-B106.