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The GBPC4001 T0G is a single-phase standard bridge rectifier from the Taiwan Semiconductor GBPC40 series. It features a 40A average forward current rating and a 100V repetitive peak reverse voltage (VRRM). The device utilizes a glass passivated chip junction within a GBPC40 package, offering high surge current capability with an IFSM of 400A. Key electrical parameters include a maximum forward voltage of 1.1V at 20A and a typical junction-to-case thermal resistance of 1.5°C/W. Operating temperatures range from -55°C to +150°C.
Verify the specific ordering code suffix against official documentation to confirm packaging details. Confirm that the component meets RoHS compliance standards and UL recognition requirements as specified in the datasheet. Ensure the selected variant matches the required current and voltage ratings for the intended application circuit.
Select this component based on the 40A current capacity and 100V voltage rating. Consider the GBPC40 package dimensions and terminal configuration for mechanical integration. Evaluate the thermal management requirements using the provided junction-to-case thermal resistance data to ensure operation within the specified temperature limits.
This part belongs to the GBPC40/50 series of standard bridge rectifiers manufactured by Taiwan Semiconductor. The series offers various voltage ratings from 50V to 1000V and current ratings of 40A or 50A. The GBPC4001 specifically denotes the 40A variant with a 100V reverse voltage rating.
Compatible substitutes include other GBPC40 series variants with matching voltage ratings, such as GBPC4002 or GBPC4004, provided they fit the same GBPC40 package and meet the electrical requirements of the circuit.
The peak forward surge current (IFSM) is rated at 400A for an 8.3ms single half sine-wave superimposed on rated load.
The junction-to-case thermal resistance (RθJC) is typically 1.5°C/W, facilitated by an integrally molded heatsink for maximum heat dissipation.
The device features universal 4-way terminals that support snap-on, wrap-around, solder, or printed circuit board (P.C. board) mounting methods.