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The Diotec Semiconductor GBUK8D is a single-phase diode bridge rectifier from the Protectifiers® series, designed for through-hole mounting in the GBU package. It provides an average forward current (IFAV) of 8 A at a case temperature of 50°C and supports a peak repetitive reverse voltage (VRRM) exceeding 400 V. The device features a typical junction-to-case thermal resistance (RthC) of 3.0 K/W per device. Electrical characteristics include a maximum forward voltage (VF) of 1.2 V at 8 A and 25°C, with a typical reverse recovery time (trr) of 1500 ns. Peak non-repetitive surge currents reach 200 A at 60 Hz and 75 A for 10/1000µs pulses.
Verify component authenticity by cross-referencing the manufacturer's datasheet specifications against the physical markings on the device. Confirm that the ordering suffix matches the required voltage rating and electrical parameters. Ensure compliance with RoHS directives and environmental standards relevant to your specific manufacturing region before finalizing procurement orders.
Select this component when an 8 A continuous current rating and over 400 V reverse voltage blocking are required. Evaluate the thermal environment to ensure the case temperature remains within limits for the specified 8 A output. Consider the 1500 ns reverse recovery time for high-frequency switching constraints and verify that the GBU package dimensions fit the target PCB layout.
This part belongs to the GBUK8 series of single-phase bridge rectifiers manufactured by Diotec Semiconductor. The series utilizes silicon technology for efficient power conversion. The 'K' designation typically indicates a specific voltage class within the product family, while the 'GBU' refers to the standardized through-hole package form factor used across multiple current ratings.
Direct replacements must match the 8 A current rating, exceed 400 V reverse voltage, and utilize the GBU package. Verify that substitute components offer equivalent or superior thermal resistance and surge current capabilities to maintain circuit reliability without redesigning the cooling infrastructure.