GC1311-154-4

Overview

The GC1311-154-4 is a surface mount hyperabrupt varactor diode from the KV1900 series, designed for high sensitivity VCO applications operating between 1 and 8 volts. It features a minimum breakdown voltage of 30V at 10μA leakage current. Capacitance values range from a minimum of 6.8pF at 1V to a maximum of 2.05pF at 8V. The device maintains a minimum quality factor of 2300 at 4V and 50MHz. It utilizes an EPSM package style with Mil Grade Ceramic/Epoxy Amalgam construction, ensuring superior consistency and repeatability for frequencies up to 6GHz.

Feature Summary

• Mil Grade Ceramic/Epoxy Amalgam construction for superior consistency and repeatability
• EPSM package styles available in multiple configurations including SOT23/SOD323 footprints
• Designed for wideband VCO and voltage tuned filter applications
• RoHS compliant gold finish

Applications

• High performance wireless surface mount options for GSM, TAGS, WANS, PCS
• Wideband VCO applications
• Voltage Tuned Filters
• VCXOs

Procurement Notes

Verify the specific package style suffix (e.g., 154) against the mechanical outline table to ensure correct footprint compatibility. Confirm RoHS compliance status and check for tape and reel availability if automated pick and place assembly is required. Consult the manufacturer for updated electrical parameters as specifications are subject to change.

Selection Notes

Select this component for designs requiring hyperabrupt capacitance-voltage curves for wide tuning ranges. Ensure the operating voltage stays within the 1-8V range for optimal sensitivity. Consider the 154 package style for specific board layout constraints compared to standard 450 series footprints. Verify thermal requirements against the -55 to +125°C operating temperature range.

Part Context

The GC1311 belongs to the KV1900 series of enhanced performance surface mount varactors. This series extends surface mount construction formats to 6GHz for high-performance wireless applications. The part is manufactured by Microchip Technology (formerly Microsemi), utilizing EPSM packaging to replace inconsistent plastic packages in demanding commercial and military environments.

Replacement Considerations

The datasheet notes that outlines directly replace SOT23 and SOD323 devices. Specific cross-references should be verified based on the exact capacitance and Q-factor requirements. Contact the applications engineering department for details on other available devices and values.