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Product Detailed Parameters
- Description：IC DGTL DOWN/UP CONV 484BGA
- Series：-
- Mfr：Texas Instruments
- Package：Bulk,Bulk
- Function：Digital Signal Processor
- Frequency：-
- RF Type：LTE, TDS-CDMA, W-CDMA
- Secondary Attributes：Up/Down Converter
- Mounting Type：Surface Mount
- Package / Case：484-BBGA
- Supplier Device Package：484-BGA (23x23)
- Grade：-
- Qualification：-
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Overview
The GC6016IZEV is a digital upconverter and downconverter integrated circuit manufactured by Texas Instruments. It functions as an RF transceiver supporting LTE, TDS-CDMA, and W-CDMA standards. The device utilizes a 484-ball BGA package. Key electrical specifications include a core supply voltage range of -0.3 V to 1.32 V and a PLL analog voltage range of -0.3 V to 2 V. It supports digital supply voltages for the transmitter within similar constraints.
Feature Summary
- Supports digital upconversion and downconversion for multiple wireless communication standards including LTE and W-CDMA.
- Integrates full-featured DUC and DDC capabilities within a single RF IC.
- Designed for high-channel-count applications with support for up to 48 channels.
Applications
- LTE base station implementations
- TDS-CDMA system integration
- W-CDMA radio frequency front ends
Procurement Notes
Verify the specific suffix 'IZEV' against the official Texas Instruments datasheet to confirm package type and temperature grade. Ensure compatibility with required digital supply voltages and core voltage levels before integration. Cross-reference pin assignments with the latest documentation to avoid interface mismatches during PCB design.
Selection Notes
Select this component when designing systems requiring integrated digital conversion for LTE, TDS-CDMA, or W-CDMA protocols. Consider the 484-ball BGA footprint for board space constraints. Evaluate power consumption profiles against the specified core and PLL voltage ranges to ensure adequate thermal management and power supply stability.
Part Context
This part belongs to Texas Instruments' portfolio of RF/IF and RFID components, specifically categorized under RF misc ICs. It serves as a digital signal processor for cellular infrastructure, bridging baseband processing and RF transmission/reception stages in modern mobile communication networks.
Replacement Considerations
Consult official TI substitution guides for verified alternatives. Generic cross-references may not match the specific 484-ball BGA form factor or the precise digital supply voltage requirements defined for this model.
FAQ
What wireless standards does the GC6016IZEV support?
It supports LTE, TDS-CDMA, and W-CDMA standards.
What is the package type for this component?
The component is housed in a 484-ball BGA package.
