GD2X10MPS12D

$4.47

Description：DIODE ARR SIC 1200V 25A TO247-3
Series：MPS™

SKU:df0ad95978ce Category: Diode Arrays Brand: GeneSiC Semiconductor

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Product introduction

GD2X10MPS12D is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE ARR SIC 1200V 25A TO247-3. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for GD2X10MPS12D

Description：DIODE ARR SIC 1200V 25A TO247-3
Series：MPS™
Mfr：GeneSiC Semiconductor
Package：Tube
Diode Configuration：1 Pair Common Cathode
Technology：SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max)：1200 V
Current - Average Rectified (Io) (per Diode)：25A
Voltage - Forward (Vf) (Max) @ If：1.8 V @ 10 A
Speed：No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr)：0 ns
Current - Reverse Leakage @ Vr：5 µA @ 1200 V
Operating Temperature - Junction：-55°C ~ 175°C
Mounting Type：Through Hole
Package / Case：TO-247-3
Supplier Device Package：TO-247-3
Grade：-
Qualification：-

Diode Arrays datasheet and documents for GD2X10MPS12D

GD2X10MPS12D

Diode Arrays Overview

The GD2X10MPS12D is a Silicon Carbide Schottky MPS diode manufactured by GeneSiC Semiconductor. It features a TO-247-3 package with a repetitive peak reverse voltage (VRRM) of 1200 V and a continuous forward current (IF) of 20 A at 159°C case temperature. The device exhibits a typical total capacitive charge (Qrr) of 64 nC, a maximum junction-to-case thermal resistance (RthJC) of 0.86 °C/W per leg, and an operating temperature range from -55°C to +175°C.

Diode Arrays Feature Summary

Utilizes Gen4 Thin Chip Technology for low forward voltage
Provides enhanced surge and avalanche robustness
Features temperature-independent fast switching characteristics
Demonstrates high dv/dt ruggedness

Diode Arrays Applications

Power Factor Correction (PFC)
Solar Inverters
Battery Chargers
High Frequency Converters
Switched Mode Power Supply (SMPS)

Diode Arrays Procurement Notes

Verify the specific manufacturing revision against the datasheet date of July 2020. Confirm compliance requirements including RoHS 2 and REACH SVHC declarations directly with the manufacturer or authorized distributor. Ensure mounting torque specifications are met during installation to maintain thermal performance integrity.

Diode Arrays Selection Notes

Select this component for applications requiring high-frequency operation and reduced cooling requirements due to its superior figure of merit. Consider the positive temperature coefficient of forward voltage for easy paralleling without thermal runaway. Evaluate the 1200V rating against system voltage peaks to ensure adequate safety margins.

Diode Arrays Part Context

This part belongs to the SiC Schottky MPS series from GeneSiC Semiconductor. It is designed as a replacement for traditional silicon rectifiers in high-efficiency power conversion systems. The TO-247-3 package facilitates screw-mounting to heatsinks for effective thermal management in industrial and automotive environments.

Diode Arrays Replacement Considerations

Check pinout compatibility when substituting other 1200V SiC diodes in TO-247-3 packages. Verify that alternative components meet the same 0.86 °C/W thermal resistance requirement to prevent overheating.