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Product Detailed Parameters
- Description：GNSS LOW PWR SIP MODULE ULTRA SM
- Series：-
- Mfr：Goertek Microelectronics Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- Function：GNSS, LNA, SAW Filter
- Frequency：1.55GHz ~ 1.615GHz
- RF Type：GPS
- Secondary Attributes：I2C Interface, SPI Interface
- Mounting Type：Surface Mount
- Package / Case：47-VFLGA Module
- Supplier Device Package：47-LGA (5.3x4.9)
- Grade：-
- Qualification：-
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Overview
The GSGL-0003 is a GNSS low-power System-in-Package (SIP) module manufactured by Goertek Microelectronics Inc. Designed for ultra-small form factor applications, this component integrates essential radio frequency functions including a Low Noise Amplifier (LNA) and a Surface Acoustic Wave (SAW) filter. It operates within the GPS frequency band of 1.55GHz to 1.615GHz. The module supports digital control via I2C and SPI interfaces, enabling efficient integration into compact electronic devices requiring precise location tracking capabilities.
Feature Summary
- Integrates LNA and SAW filter within a single SIP package
- Optimized for ultra-small footprint requirements
- Supports I2C and SPI interface protocols
Applications
- GPS navigation systems
- Location tracking devices
- Compact wearable electronics
Procurement Notes
Verify the specific ordering suffix against official distributor catalogs to ensure correct packaging configuration. Confirm that the selected variant matches the required interface and pinout specifications for your design. Cross-reference the manufacturer's active status documentation to guarantee supply chain stability before finalizing procurement plans.
Selection Notes
Select this module when space constraints are critical due to its ultra-small SIP design. Ensure the host system supports the required I2C or SPI communication protocols. Verify compatibility with the 1.55GHz to 1.615GHz frequency range for optimal GPS signal reception performance in the target application environment.
Part Context
Goertek Microelectronics Inc., established in October 2017, specializes in MEMS devices and microsystem modules. The company focuses on R&D, production, and sales of sensors and related components. This part represents their capability in integrating RF functions into compact packages for modern consumer electronics.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official manufacturer documentation for potential cross-references or updated series replacements.
