GSXD080A010S1-D3

Overview

The GSXD080A010S1-D3 is a Schottky diode array manufactured by SemiQ, housed in a SOT-227-4 (miniBLOC) chassis mount package. It features two independent diodes with a maximum repetitive peak reverse voltage of 100 V and a continuous average rectified forward current of 160 A per diode. The device exhibits a fast recovery time of less than or equal to 500 ns and a maximum reverse leakage current of 1 mA at 100 V.

Feature Summary

• Schottky barrier technology for low forward voltage drop and high efficiency
• Dual independent diode configuration within a single chassis mount package
• Designed for high-current rectification applications requiring robust thermal management

Applications

• High-current DC power supply rectification
• Low-voltage power management systems
• Industrial motor drive freewheeling circuits

Procurement Notes

Verify the specific datasheet version from SemiKey/SemiQ to confirm electrical characteristics and mechanical dimensions. Ensure the ordering suffix matches the required packaging and lead-free status. Cross-reference pinout configurations with the official SOT-227-4 standard before integration into PCB designs.

Selection Notes

Select this component when high continuous current handling and low reverse recovery charge are critical. The chassis mount form factor necessitates direct mounting to a heatsink for adequate thermal dissipation. Evaluate the 100 V reverse voltage rating against peak transient voltages in the target circuit to ensure reliable operation under all conditions.

Part Context

This part belongs to the GSX series of high-power Schottky rectifiers from SemiQ. These devices utilize advanced silicon carbide or specialized silicon technologies to achieve superior performance compared to standard PN junction diodes. The miniBLOC package provides a standardized interface for high-power industrial modules.

Replacement Considerations

Direct substitutes include other SOT-227-4 packaged Schottky arrays with comparable 100 V and 160 A ratings. Verify that alternative parts maintain identical pinout assignments and thermal resistance values to ensure compatibility without redesigning the cooling infrastructure.