GX74870-200-11

Overview

The GX74870-200-11 is a Low Power Bluetooth 5.3 System-on-Chip (SoC) manufactured by Renesas Electronics Corporation. It integrates an ARM Cortex-M0+ core with a maximum operating frequency of 160 MHz. The device supports Bluetooth 5.3, BLE 5.0, and Bluetooth versions 5.1 through 5.2, along with compliance to Bluetooth v6.0 specifications for audio applications. Key electrical parameters include a maximum data rate of 2 Mbps, a transmit output power of up to 6 dBm, and receive sensitivity ranging from -97 dBm to -76 dBm. The supply voltage operates between a minimum of 1.7 V and a maximum of 3.3 V. Current consumption varies, with receive current as low as 1.8 mA and transmission current reaching up to 280 mA. Program memory capacity ranges from 4 kB to 1024 kB depending on the specific configuration. The component functions within a temperature range of -40°C to +85°C and is available in packages such as QFN-24, QFN-40, and WLCSP-34.

Feature Summary

• Integrates an ARM Cortex-M0+ processor core optimized for low-power wireless connectivity applications.
• Supports comprehensive Bluetooth 5.3 protocol stack including BLE and legacy modes with v6.0 compliance.
• Delivers configurable RF performance with adjustable output power and high receiver sensitivity.

Applications

• Low-Power Dual Mode Bluetooth audio devices
• Bluetooth v6.0 compliant audio systems
• BLE sensor nodes and peripherals

Procurement Notes

Verify the manufacturing status before procurement, as this product is listed as no longer manufactured. Confirm package availability and lead times with authorized distributors. Ensure design-in compatibility with existing firmware and hardware layouts if replacing active components. Check for end-of-life notifications or recommended replacement parts from Renesas Electronics Corporation.

Selection Notes

Select this SoC for designs requiring integrated Bluetooth 5.3 connectivity with minimal external components. Consider the trade-off between current consumption modes and required transmit power levels. Verify that the available program memory meets application code size requirements. Ensure the operating temperature range aligns with the target environment constraints.

Part Context

This component belongs to Renesas' portfolio of RF System-on-Chips designed for wireless connectivity. It combines processing capabilities with radio transceivers to reduce board space and complexity. The series targets consumer electronics and IoT devices needing reliable short-range communication.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult Renesas Electronics Corporation directly for current lifecycle status and potential obsolescence management options.