SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The HCF4013BEY is a monolithic integrated circuit fabricated in Metal Oxide Semiconductor technology, belonging to the 4000B series. It contains two independent D-type flip-flops with set and reset capabilities. The device supports static flip-flop operation, retaining state indefinitely regardless of clock level. It features standardized symmetrical output characteristics and medium-speed operation with a typical clock toggle rate of 16 MHz at 10 V supply voltage. Quiescent current is specified up to 20 V, and input leakage current is limited to 100 nA maximum at VDD = 18 V and TA = 25°C. It meets JEDEC JESD13B standard specifications for B series CMOS devices.
Verify the specific suffix BEY corresponds to the 14-lead dual in-line plastic package variant when sourcing. Confirm that the component meets the required environmental standards for your application, as the HCF series is designed for intermediate temperature ranges. Ensure compatibility with existing PCB footprints for DIP-14 packages during procurement planning.
Select this component when dual independent D-type flip-flops are required within a single package. The HCF4013BEY offers robust performance with high noise immunity typical of CMOS technology. Consider the 16 MHz typical toggle rate for speed requirements. Verify that the 14-pin DIP package fits the mechanical constraints of the target design compared to surface-mount alternatives.
This part belongs to the STMicroelectronics HCF4000B series of CMOS logic integrated circuits. The series is characterized by high noise immunity and wide operating voltage ranges. The HCF4013 specifically provides dual D-type flip-flops, distinguishing it from other logic gates or buffers in the same family. It is widely used in general-purpose digital electronics applications requiring reliable state retention.
Direct substitutes include the HCC4013BEY for extended temperature range applications. Cross-manufacturer equivalents such as the MC14013B from ON Semiconductor or NXP may be compatible if pinouts and electrical characteristics align. Verify package dimensions and thermal ratings before substitution.