HGT1S3N60C3DS

HGT1S3N60C3DS

$0.78
  • Description:IGBT 600V 6A TO-263AB
  • Series:-

SKU:59d0321f1829 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IGBT 600V 6A TO-263AB
  • Series:-
  • Mfr:Harris Corporation
  • Package:Bulk
  • IGBT Type:-
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):6:00 AM
  • Current - Collector Pulsed (Icm):-
  • Vce(on) (Max) @ Vge, Ic:-
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:-
  • Test Condition:-
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
  • Supplier Device Package:TO-263AB
  • Grade:-
  • Qualification:-

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HGT1S3N60C3DS

Overview

The HGT1S3N60C3DS is a 600 V, N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by Harris Corporation. It features a maximum continuous collector current of 6 A and is housed in a TO-263AB package. This component is designed for high-efficiency switching applications requiring robust voltage handling capabilities.

Feature Summary

  • N-channel IGBT configuration
  • 600 V breakdown voltage rating
  • TO-263AB surface-mount package

Applications

  • Power supply circuits
  • Motor control systems
  • Inverter designs

Procurement Notes

Verify the manufacturer origin carefully, as this part number appears across multiple vendors including Intersil, Renesas, Fairchild, and Rochester Electronics. Confirm that the specific unit matches the original Harris specifications if required for legacy compatibility. Check datasheet revisions to ensure parameter consistency across different production sources.

Selection Notes

Select this component when a 600 V blocking capability and 6 A continuous current are required in a compact surface-mount form factor. The TO-263AB package facilitates thermal management through direct mounting to a heatsink. Ensure gate drive requirements align with standard IGBT logic levels for reliable switching performance.

Part Context

Originally developed by Harris Semiconductor, this device was later integrated into the portfolios of Intersil and subsequently Renesas Electronics following corporate acquisitions. Fairchild Semiconductor also produced equivalent versions under similar naming conventions. The part represents a transition period in power semiconductor manufacturing history.

HGT1S3N60C3DSHGT1S3N60C3DS
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