HMC1040CHIPS-SX

Overview

The HMC1040CHIPS-SX is a GaAs pHEMT MMIC low noise amplifier from Analog Devices Inc., operating within the 20 GHz to 44 GHz frequency range. It features a typical gain of 25 dB and a noise figure of 2.2 dB. The device requires a supply voltage of 2.5 V and draws 70 mA of current. Key performance metrics include a P1dB compression point of 12 dBm and an OIP3 of 22 dBm. It dissipates 490 mW of power and functions reliably between -40°C and +85°C.

Feature Summary

• Utilizes GaAs pHEMT technology for high-performance signal amplification in the millimeter-wave spectrum.
• Provides broadband operation across the 20 GHz to 44 GHz range with consistent gain characteristics.
• Designed as a bare die component suitable for custom integration into advanced RF systems.

Applications

• Software Defined Radio (SDR) front-ends
• Electronic Warfare (EW) systems
• Radar receiver chains
• Satellite communication uplinks and downlinks

Procurement Notes

Verify that the specific suffix SX denotes the tape-and-reel packaging format for the bare die variant, distinct from other package options like the LP3CE QFN or standard chip form. Confirm RoHS compliance status directly with the manufacturer documentation, as regulatory requirements may vary by region and production batch. Ensure handling procedures account for the sensitive nature of bare die components during assembly.

Selection Notes

Select this component when a wide bandwidth covering 20 GHz to 44 GHz is required alongside low noise performance. The bare die format necessitates careful PCB layout and thermal management design due to the direct mounting requirement. Evaluate the trade-off between the 2.2 dB noise figure and the 25 dB gain against system-level link budget calculations to ensure adequate signal-to-noise ratio without excessive linearity distortion.

Part Context

This part belongs to the HMC1040 series of low noise amplifiers manufactured by Analog Devices Inc. using GaAs pHEMT technology. The series includes various package options such as the HMC1040LP3CE in a QFN-16 package and the bare die HMC1040CHIPS. The HMC1040CHIPS-SX specifically refers to the reel-packaged version of the bare die component, maintaining identical electrical specifications to the standard chip variant.

Replacement Considerations

The HMC1040CHIPS serves as the functional equivalent to the HMC1040CHIPS-SX, differing only in packaging format rather than electrical performance. Designers must verify mechanical compatibility and soldering profiles when substituting between bare die and packaged variants within the same family.