HMC1087F10

Overview

The HMC1087F10 is an 8W Gallium Nitride (GaN) MMIC power amplifier operating between 2 and 20 GHz. It provides approximately 11 dB small-signal gain and +39 dBm saturated output power. The device utilizes a distributed architecture and is housed in a non-hermetic, air cavity 10-lead flange mount package. This component is designed for high-power RF applications requiring wide bandwidth performance.

Feature Summary

• Utilizes Gallium Nitride (GaN) technology for high power density
• Features a distributed amplifier architecture for wideband operation
• Constructed as a non-hermetic air cavity device
• Designed for flange mount integration

Applications

• Electronic Warfare systems
• Radar transmitters
• Communications infrastructure

Procurement Notes

Verify the specific revision suffix and packaging configuration with Analog Devices or authorized distributors before ordering. Confirm that the receiving facility has appropriate handling procedures for non-hermetic air cavity components. Ensure mechanical compatibility with the intended flange mount interface. Check for any recent supply constraints or lifecycle status updates directly from the manufacturer.

Selection Notes

Select this component when an 8W output capability across the 2–20 GHz spectrum is required. The flange mount package necessitates specific thermal management and mechanical mounting solutions distinct from surface-mount devices. Evaluate system requirements against the +39 dBm saturation point to ensure adequate headroom. Consider the non-hermetic nature of the package for environmental sealing strategies.

Part Context

This part belongs to Analog Devices' portfolio of GaN MMIC power amplifiers. It is distinct from lower-power variants and different package styles within the same frequency range. The HMC1087 series represents high-performance solutions for demanding RF environments where wide bandwidth and high linearity are critical design parameters.

Replacement Considerations

Consult official Analog Devices documentation for qualified substitute part numbers. Verify pinout compatibility and thermal characteristics if considering alternative packages. Do not assume functional equivalence with other series without explicit manufacturer validation.