HMC408LP3E

Overview

The HMC408LP3E is a GaAs InGaP HBT MMIC power amplifier designed for the 5.1 GHz to 5.9 GHz frequency range, covering HiperLAN and UNII bands. It delivers a gain of 20 dB with a P1dB output power of +30 dBm and a noise figure of 6 dB. The device operates on a single +5V supply, drawing 750 mA of current. Packaged in a 16-VFQFN (3x3 mm) surface-mount housing with an exposed pad, it supports applications requiring high efficiency and medium power output in wireless communication systems.

Feature Summary

• Utilizes GaAs InGaP Heterojunction Bipolar Transistor technology for high efficiency performance
• Provides fixed 20 dB gain suitable for narrow-band medium power applications
• Features a compact 16-pin QFN package with an exposed thermal pad for effective heat dissipation

Applications

• HiperLAN wireless local area network transmitters
• UNII band wireless communication systems
• 5.1-5.9 GHz RF signal chain power amplification stages

Procurement Notes

Verify component authenticity through authorized Analog Devices channels or certified distributors. Confirm RoHS compliance status and check for recent Product Change Notifications regarding manufacturing updates. Ensure storage conditions meet moisture sensitivity level requirements prior to assembly. Validate that the specific suffix matches design specifications for thermal and electrical characteristics.

Selection Notes

Select this component for designs requiring a single-supply solution in the 5.1-5.9 GHz range. The 20 dB gain and +30 dBm P1dB make it suitable for driving subsequent stages without additional amplification. Consider the 16-QFN footprint for PCB layout constraints and ensure adequate thermal grounding via the exposed pad to maintain performance at full output power.

Part Context

This part belongs to the HMC408 family of GaAs HBT MMICs from Analog Devices. It is specifically engineered as a medium-power amplifier for unlicensed industrial, scientific, and medical radio bands. The LP3E designation indicates the lead-free, tape-and-reel packaging variant compatible with standard surface-mount reflow processes.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.