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Product Detailed Parameters
- Description:IC RF AMP GPS 0HZ-20GHZ 32CSMT
- Series:-
- Mfr:Analog Devices Inc.
- Package:Strip
- Frequency:0Hz ~ 20GHz
- P1dB:16dBm
- Gain:14dB
- Noise Figure:2.5dB
- RF Type:General Purpose
- Voltage - Supply:8V
- Current - Supply:75mA
- Test Frequency:10GHz
- Mounting Type:Surface Mount
- Package / Case:32-TFCQFN Exposed Pad
- Supplier Device Package:32-CSMT (5x5)
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Overview
The HMC460LC5 is a GaAs MMIC pHEMT low noise distributed amplifier designed for operation from DC to 20 GHz. It features a gain of 13 dB and a noise figure of 3.5 dB. The device operates on an 8 V supply with a current draw of 75 mA. Key performance metrics include a P1dB compression point of 16.5 dBm and an OIP3 of 28.5 dBm. Input return loss is specified at 12 dB. It utilizes a CLCC-32 leadless ceramic surface mount package, measuring 5 x 5 mm. The unit weight is 3.266 g, and it supports a power dissipation of 2 W.
Feature Summary
- Utilizes GaAs pHEMT technology for high-frequency signal amplification
- Distributed amplifier architecture ensures wideband stability from DC to 20 GHz
- Leadless ceramic surface mount package provides thermal efficiency and compact footprint
Applications
- VSAT communication systems
- Point-to-point microwave links
- Test and measurement instrumentation
- Military electronic warfare systems
Procurement Notes
Verify component authenticity through authorized Analog Devices channels due to limited availability status. Confirm RoHS compliance and moisture sensitivity level (MSL 3) handling requirements during storage and assembly. Ensure soldering profiles match the leadless ceramic package specifications to prevent thermal damage. Cross-reference datasheet revisions to confirm electrical parameter consistency before finalizing procurement orders.
Selection Notes
Select this component when requiring ultra-wideband amplification from DC to 20 GHz with low noise characteristics. Consider the 13 dB gain and 3.5 dB noise figure for sensitive receiver front-ends. Evaluate the 8 V supply requirement against system power constraints. The 5 x 5 mm ceramic package suits applications demanding robust thermal management in dense PCB layouts compared to standard plastic packages.
Part Context
Part of the HMC460 series, the HMC460LC5 serves as a core RF building block for high-performance wireless infrastructure. It complements other Analog Devices MMICs by providing wideband gain stages where frequency agility is critical. Its design supports integration into complex signal chains requiring minimal external matching components.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing board layouts if considering alternative family members.
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