HMC578LC3BTR

Overview

The HMC578LC3BTR is a surface-mount x2 active frequency multiplier from Analog Devices, designed for DBS and VSAT applications. It operates with an input frequency range of 23 GHz to 33 GHz. The device utilizes Gallium Arsenide (GaAs) technology and is housed in a 12-SMT (3x3 mm) package. It requires a supply voltage between 4.5 V and 5.5 V, drawing a typical operating current of 81 mA. Power dissipation is rated at 703 mW, and it functions within a temperature range of -55°C to +85°C.

Feature Summary

• Integrates x2 active multiplication functionality in a compact surface-mount form factor
• Optimized for high-frequency operation in DBS and VSAT communication systems
• Utilizes GaAs technology for reliable performance across extended industrial temperature ranges

Applications

• Direct Broadcast Satellite (DBS) uplink systems
• Very Small Aperture Terminal (VSAT) networks
• High-frequency signal generation chains

Procurement Notes

Verify the specific suffix 'R5' against your bill of materials, as it indicates reel packaging. Confirm that the 12-SMT footprint matches your PCB layout constraints. Ensure your power supply provides stable 4.5V to 5.5V DC. Check thermal management requirements given the 703 mW dissipation rating. Validate compatibility with GaAs process design kits if integrating into custom assemblies.

Selection Notes

Select this component when a precise x2 multiplication is required above 20 GHz. Compare against the bare die HMC578 if board space allows for wire bonding. Consider the HMC576 series for lower frequency bands below 29 GHz. Evaluate thermal resistance capabilities for enclosed environments. Verify that the 12-pin QFN package aligns with automated assembly equipment specifications.

Part Context

This part belongs to the HMC578G family of active multipliers. It serves as the packaged SMT version of the HMC578 bare die. The LC3B designation typically denotes specific pinout or packaging variations within the active multiplier portfolio. It complements other RF chain components like mixers and amplifiers in satellite transponder designs.

Replacement Considerations

HMC578: Bare die equivalent requiring different packaging infrastructure.