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HMPP-389T-TR2 is listed in the RF Diode range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is RF DIODE PIN 100V MINIPAK 1412. Review the specifications below when checking this part for your BOM.
The HMPP-389T-TR2 is a surface mount RF PIN switch diode from the Broadcom Limited HMPP-389x series, housed in a MiniPak 1412 leadless package. It functions as a low inductance wide band shunt switch optimized for applications up to 6 GHz. The device features a single diode configuration with a maximum breakdown voltage of 100 V and a maximum total capacitance of 0.30 pF at 5 V reverse bias. Its typical series resistance is 3.8 Ω at 1 mA forward current, with a carrier lifetime of 200 ns. The component supports a peak inverse voltage of 100 V and operates within a junction temperature range of -65°C to +150°C.
Verify the specific ordering suffix against the manufacturer's documentation to confirm container type and quantity. The TR2 suffix indicates a 13-inch reel containing 10,000 devices. Ensure compatibility with standard surface mount assembly processes, noting that the maximum reflow temperature should not exceed 260°C. Confirm availability status directly with authorized distributors as supply conditions may vary.
Select this component when designing circuits requiring a shunt switch topology with minimal parasitic inductance. The MiniPak 1412 package is preferred over SOT-23 or SC-70 packages for frequencies exceeding conventional limits due to lower package parasitics. Consider the 100 V peak inverse voltage rating for robustness in high-voltage reverse bias scenarios. Evaluate the 0.30 pF maximum capacitance to ensure it meets the isolation requirements of the target frequency band.
The HMPP-389T-TR2 belongs to the HMPP-389x series of miniaturized PIN diodes manufactured by Broadcom Limited (formerly Avago Technologies). This series utilizes advanced semiconductor processing combined with leadless ceramic-based packaging technology. The product line includes single, anti-parallel, parallel, and shunt switch configurations, all designed to offer matched performance and high reliability through adjacent wafer site packaging.
The HSMP-389T is a direct functional equivalent utilizing an SC-70 package. While electrically similar, the HSMP-389T exhibits higher parasitic inductance due to its leaded construction. Designers replacing the HMPP-389T with the HSMP-389T must account for potential performance degradation at frequencies approaching 6 GHz.
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