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HSMP-386B-BLKG is listed in the RF Diode range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is RF DIODE PIN 50V SOT-323. Review the specifications below when checking this part for your BOM.
The HSMP-386B-BLKG is a general-purpose silicon PIN diode from the HSMP-386x series, manufactured by Broadcom Limited. It features a single diode configuration housed in an SOT-323 (SC-70) surface-mount package. The device has a breakdown voltage of 50 V and a typical total capacitance of 0.20 pF at 1 MHz with 50 V reverse bias. Its typical series resistance is 3.0 Ω at 10 mA forward current and 1.5 Ω at 100 mA. The component supports a maximum forward current of 1 A under pulse conditions and operates within a junction temperature range up to 150°C.
Verify the specific ordering suffix against official documentation to confirm packaging details. The -BLKG suffix indicates bulk packaging containing 100 pieces per antistatic bag. Confirm that the SOT-323 package variant matches the design requirements. Ensure compliance with lead-free assembly standards as specified in the datasheet.
Select this component when low capacitance is critical for switch isolation or when low forward current is preferred for attenuator efficiency. Compare the 0.20 pF capacitance and 50 V breakdown voltage against circuit requirements. Consider the SOT-323 footprint constraints and thermal resistance specifications for the application environment.
This part belongs to the HSMP-386x family of surface mount PIN diodes produced by Broadcom Limited. The series includes various configurations such as single, series, common anode, and common cathode arrangements. The HSMP-386B specifically denotes the single diode version within this lineup, distinct from paired or multi-diode variants like the HSMP-386C or HSMP-386F.
Direct substitutes within the same series include HSMP-3860, HSMP-386C, HSMP-386E, and HSMP-386F, which share similar electrical characteristics but differ in internal configuration. Verify pinout compatibility and package dimensions before substitution.
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