IGC99T120T8RQX1SA1

Description：IGBT TRENCH FS 1200V 100A DIE
Series：TrenchStop™

SKU:8d92a47662cb Category: Single IGBTs Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT TRENCH FS 1200V 100A DIE
Series：TrenchStop™
Mfr：Infineon Technologies
Package：Bulk
IGBT Type：Trench Field Stop
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：100 A
Current - Collector Pulsed (Icm)：300 A
Vce(on) (Max) @ Vge, Ic：2.42V @ 15V, 100A
Power - Max：-
Switching Energy：-
Input Type：Standard
Gate Charge：-
Td (on/off) @ 25°C：-
Test Condition：-
Reverse Recovery Time (trr)：-
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Die
Grade：-
Qualification：-

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IGC99T120T8RQX1SA1

Overview

The IGC99T120T8RQ is a bare die IGBT utilizing TRENCHSTOP™ IGBT4 High Speed Chip technology. It features a 1200 V collector-emitter voltage rating and a nominal continuous collector current of 100 A at a case temperature of 100 °C. The device has a die size of 9.5 mm x 10.35 mm with a thickness of 115 µm. Maximum ratings include a pulsed collector current of 300 A, a gate-emitter voltage limit of ±20 V, and an operating junction temperature range from -40 °C to +175 °C. The integrated gate resistor is typically 7.5 Ω.

Feature Summary

Utilizes trench and field stop technology for low switching losses
Features a positive temperature coefficient for easy paralleling
Includes an integrated gate resistor

Applications

High frequency drives
Uninterruptible power supplies
Welding equipment
Solar inverters

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm exact specifications. Confirm that the component is supplied as a bare die on foil rather than a packaged module. Ensure compliance with electrostatic discharge handling requirements per MIL-STD 883 during storage and assembly processes.

Selection Notes

Select this component for designs requiring high-speed switching capabilities within medium power modules. Evaluate thermal management strategies carefully, as switching characteristics depend heavily on the final module design and mounting technology. Verify suitability for industrial applications, noting it lacks automotive qualification.

Part Context

This component belongs to the IGBT4 family, specifically designed for industrial power control applications. It serves as a semiconductor chip intended for integration into larger power modules rather than standalone discrete use. The product line emphasizes efficiency and reliability in high-frequency power conversion systems.