IM06B30AC1XKMA1

IM06B30AC1XKMA1

$8.39
  • Description:IM06B30AC1XKMA1
  • Series:CIPOS™

SKU:ce91720194c7 Category: Brand:

  
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Product Detailed Parameters

  • Description:IM06B30AC1XKMA1
  • Series:CIPOS™
  • Mfr:Infineon Technologies
  • Package:Tray
  • Type:IGBT
  • Configuration:3 Phase Inverter
  • Current:30 A
  • Voltage:650 V
  • Voltage - Isolation:2000Vrms
  • Mounting Type:Through Hole
  • Package / Case:24-PowerDIP Module (1.028", 26.10mm)
  • Grade:-
  • Qualification:-

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IM06B30AC1XKMA1

Overview

The IM06B30AC1XKMA1 is a three-phase intelligent power module from the CIPOS Mini series, manufactured by Infineon Technologies. It utilizes silicon IGBT technology and features an open emitter configuration with integrated gate drivers. The device operates within a collector-emitter voltage range of up to 600 V and supports a continuous collector current of 30 A at 25°C. Key electrical parameters include a saturation voltage of 1.35 V and a maximum power dissipation of 33.8 W. It is housed in a compact DIP-24 package designed for through-hole mounting, with an operating temperature range spanning from -40°C to +150°C.

Feature Summary

  • Integrates six-channel IGBT switches with dedicated gate driver circuits for simplified control.
  • Includes built-in NTC thermistor for precise thermal monitoring and protection.
  • Features open emitter topology allowing independent phase control and flexible system design.

Applications

  • Industrial motor drives
  • Pump and compressor control systems
  • Servo drive inverters

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to ensure correct packaging and variant specifications. Confirm RoHS compliance status and material content declarations via the manufacturer's data sheet before procurement. Cross-reference the component marking code with the datasheet to authenticate the source and prevent counterfeit substitution during acquisition.

Selection Notes

Select this module for applications requiring high integration in a small footprint while maintaining robust thermal performance. The 30 A rating suits medium-power industrial loads. Ensure the PCB layout accommodates the DIP-24 through-hole form factor and provides adequate clearance for the 600 V isolation requirements. Evaluate the 33.8 W power dissipation against the available heatsinking capacity to maintain junction temperatures within safe limits.

Part Context

This component belongs to the CIPOS Mini family, which consolidates power semiconductors and driver electronics into a single package. The series targets space-constrained designs where reducing component count and assembly complexity is critical. The IM06B30AC1XKMA1 represents a specific current rating variant within this broader product line, offering a balance between current handling capability and physical size.

Replacement Considerations

Consult the official CIPOS Mini application notes for verified substitute part numbers within the same series. Direct replacements must match the DIP-24 package, 600 V rating, and 30 A current specification. Verify pin compatibility and thermal characteristics before substituting any alternative components.

IM06B30AC1XKMA1IM06B30AC1XKMA1
$8.39
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