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The Infineon IM241M6S1BAUMA1 is a CIPOS Micro intelligent power module featuring a 600 V reverse conducting IGBT topology. It integrates three half-bridge drivers with bootstrap functionality and overcurrent protection. The SOP package includes accessible low-side emitters for phase current monitoring. Operating temperatures range from -40°C to 150°C junction, with a maximum collector current of 4 A.
Verify the specific suffix 'B' indicates the fast speed version designed for low losses. Confirm the SOP 29x12 surface mount package type matches the design requirements. Ensure the component meets industrial qualification standards per JEDEC47/20/22 before integration into final products.
Select this module for applications requiring integrated protection and compact PCB size. The open emitter configuration allows for external current sensing. Verify logic compatibility with 3.3 V or 5.0 V controllers. Consider thermal resistance values when designing heat dissipation solutions for continuous operation.
This component belongs to the CIPOS Micro IM241 product group, which combines power and control components to optimize system costs. The series offers both surface mount and through-hole configurations. It utilizes industry-benchmarked rugged half-bridge drivers for reliable performance in demanding environments.
IM241-M6T2B is a DIP equivalent within the same family. IM241-M6S1J is the slow speed variant for low EMI applications. Cross-referencing pinouts and thermal characteristics is required when substituting these parts.