INA110SG

Overview

The INA110SG is a precision instrumentation amplifier from Texas Instruments featuring FET inputs for high accuracy and fast settling. It operates on a single supply voltage ranging from 12 V to 36 V, with a maximum rating of 36 V. The device provides a 3 dB bandwidth of 470 kHz and a slew rate of 12 V/µs. Key electrical specifications include a common-mode rejection ratio (CMRR) of 106 dB, an input bias current of 50 pA, and an input offset voltage of 250 µV. It draws 3 mA of operating supply current and functions within a temperature range of -55°C to +125°C.

Feature Summary

• Fast-settling performance suitable for demanding signal conditioning applications
• FET input stage ensures extremely low input bias current for minimal loading effects
• High accuracy characteristics with low input offset voltage and high CMRR

Applications

• Precision data acquisition systems
• Medical instrumentation requiring high isolation and accuracy
• Industrial process control sensors

Procurement Notes

Verify the specific suffix 'SG' against the manufacturer's official datasheet to confirm package type and temperature grade. Ensure the ordering part number matches the required through-hole configuration and industrial temperature range specifications before procurement.

Selection Notes

Select this component when high accuracy and fast settling are required in a single-supply environment. The FET input architecture makes it suitable for high-impedance sources where low bias current is critical. Compare bandwidth and power consumption requirements against other INA110 variants if surface-mount options are preferred.

Part Context

This device belongs to the INA110 series of instrumentation amplifiers manufactured by Texas Instruments. The series is designed for general-purpose high-precision applications. The SG suffix typically denotes a specific package style and temperature range within the broader product family.

Replacement Considerations

INA110KU offers similar electrical performance but utilizes a surface-mount package instead of through-hole.