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The INA317IDGKR is a micro-power, zero-drift instrumentation amplifier manufactured by Texas Instruments. It operates on a single supply voltage ranging from 1.8 V to 5.5 V with a typical quiescent current of 50 uA. The device features a 350 Hz 3dB bandwidth and a slew rate of 50 mV/us. Key electrical specifications include a common-mode rejection ratio (CMRR) of 100 dB, an input bias current of 200 pA, and an input offset voltage of 10 uV. It offers a gain range from 1 V/V to 1000 V/V with a gain error of 0.25%. The component is housed in an 8-pin VSSOP package and supports operating temperatures from -40°C to +125°C.
Verify the specific suffix IDGKR corresponds to the VSSOP-8 package and tape-and-reel or cut-tape availability as required. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure ESD handling procedures are followed during assembly due to the sensitive input stage characteristics.
Select this component when ultra-low power consumption is critical alongside high DC accuracy. The zero-drift technology makes it ideal for applications requiring minimal calibration over wide temperature ranges. Compare against standard chopper amplifiers if higher bandwidth is needed, as this device is optimized for low-frequency precision rather than high-speed transient response.
This part belongs to the INA317 series of instrumentation amplifiers designed for high-precision, low-power applications. It integrates a zero-drift amplifier core to eliminate the need for external trimming. The family focuses on providing stable gain and high CMRR in a compact surface-mount package, targeting portable and industrial sensing markets where power efficiency and long-term stability are paramount.
Check datasheets for pin-compatible alternatives within the TI instrumentation amplifier portfolio. Verify that substitute parts match the 1.8V to 5.5V supply range and 50uA current consumption limits. Ensure the replacement maintains similar zero-drift performance and VSSOP-8 packaging for direct board footprint compatibility.