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IRF7799L2TR1PBF is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 250V 375A DIRECTFET. Review the specifications below when checking this part for your BOM.
The IRF7799L2TR1PBF is a single N-channel HEXFET power MOSFET utilizing DirectFET L8 packaging. It features a drain-source voltage of 250 V and a maximum on-resistance of 38 mΩ at 10 V gate drive. The device supports a continuous drain current of 35 A at case temperature of 25°C, with a total gate charge of 110 nC. It operates within a junction temperature range of -55°C to +175°C and offers dual-sided cooling compatibility.
Verify the specific TR1 suffix indicates a mini-reel configuration containing 1000 units, distinct from the standard 4000-unit reel. Confirm component availability status as end-of-life notices may apply. Ensure procurement channels support the required tape and reel format for surface mount assembly processes.
Select this component when a 250 V rating is required alongside low conduction losses in a compact form factor. Evaluate thermal management requirements against the dual-sided cooling capability of the DirectFET package. Consider the gate charge specifications for driving efficiency in high-speed switching topologies compared to standard packages.
This part belongs to the DirectFET family, designed to replace larger packages like D2PAK while maintaining or improving thermal performance. It integrates the latest silicon technology into an isometric lead frame structure, enabling efficient heat transfer through both the top drain and bottom substrate surfaces.
Check for direct pin-compatible alternatives within the same DirectFET L8 series offering different voltage or resistance ratings. Verify that any substitute maintains the necessary 250 V breakdown voltage and compatible gate threshold characteristics for existing driver circuits.
The maximum operating junction temperature is +175°C.
Yes, the DirectFET L8 package is explicitly designed to be compatible with dual-sided cooling to maximize thermal transfer.
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