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IRF8313TRPBF is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 2N-CH 30V 9.7A 8SO. Review the specifications below when checking this part for your BOM.
The IRF8313TRPbF is an N-channel HEXFET Power MOSFET housed in a lead-free SO-8 surface-mount package. It features a drain-to-source voltage rating of 30V and a continuous drain current capability of up to 9.7A at 25°C ambient temperature. The device incorporates optimized silicon technology designed for synchronous buck operation, providing a maximum on-resistance of 15.5mΩ at VGS=10V and a total gate charge of 6.0nC typ. Fully characterized avalanche characteristics ensure reliability under transient conditions.
Verify the ordering suffix TRPbF corresponds to the tape and reel packaging format containing 4000 units per standard pack. Confirm that the component meets RoHS compliance and halogen-free requirements as specified in the manufacturer's qualification data. Ensure the application environment remains within the absolute maximum ratings for junction temperature and thermal resistance.
Select this component for applications requiring high-efficiency power conversion where low gate drive loss is critical. The SO-8 package offers a compact footprint suitable for space-constrained designs. Evaluate the thermal management strategy based on the junction-to-ambient thermal resistance of 62.5°C/W when operating without a heatsink. Consider the 20V maximum gate-source rating when designing the driver circuitry.
This part belongs to the HEXFET family of power MOSFETs manufactured by Infineon Technologies (formerly International Rectifier). The 'TRPbF' suffix indicates a specific packaging configuration using a tape and reel format, distinguishing it from the tube-packaged IRF8313PbF variant. Both variants share identical electrical specifications and pinouts.
The IRF8313PbF serves as the direct tube-packaged equivalent with identical electrical parameters. When substituting, verify that the alternative package type accommodates the required PCB layout dimensions and thermal dissipation paths.
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