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IRFR224TR is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is MOSFET N-CH 250V 3.8A DPAK. Review the specifications below when checking this part for your BOM.
The IRFR224TR is a third-generation N-channel power MOSFET from Vishay Siliconix, housed in a DPAK (TO-252) surface-mount package. It features a drain-source voltage of 250 V and a continuous drain current of 3.8 A at 25 °C case temperature. The device exhibits a maximum on-resistance of 1.1 Ω at VGS = 10 V and a total gate charge of 14 nC. It supports repetitive avalanche energy ratings up to 130 mJ and includes a dynamic dV/dt rating for ruggedized operation.
Verify the specific ordering suffix to confirm lead-free status and tape-and-reel packaging configuration. Confirm that the component meets RoHS and halogen-free material categorization requirements for your assembly process. Ensure compatibility with vapor phase, infrared, or wave soldering techniques as specified for the DPAK package.
Select this component for designs requiring high breakdown voltage with moderate current handling capabilities. Evaluate the thermal resistance parameters against your PCB copper area to ensure junction temperatures remain within limits. Consider the gate charge specifications when designing drive circuits to optimize switching speed and minimize driver losses.
This part belongs to the IRFR series of third-generation power MOSFETs manufactured by Vishay Siliconix. These devices are engineered to balance switching speed, conduction losses, and cost-effectiveness. The IRFR224 variant specifically targets high-voltage applications where avalanche ruggedness and fast switching are critical design constraints.
IRFR224PbF
Yes, the datasheet specifies that the device is repetitive avalanche rated with a single pulse avalanche energy (EAS) of 130 mJ and a repetitive avalanche energy (EAR) of 4.2 mJ.
The device features a dynamic dV/dt rating of 4.8 V/ns, which allows it to handle the rapid voltage changes associated with the reverse recovery of the intrinsic source-drain body diode.
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