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IRFZ46ZS is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 55V 51A D2PAK. Review the specifications below when checking this part for your BOM.
The IRFZ46ZS is a HEXFET Power MOSFET manufactured by Infineon Technologies, available in D2Pak (IRFZ46ZSPbF), TO-220AB (IRFZ46ZPbF), and TO-262 (IRFZ46ZLPbF) packages. It features an N-channel silicon construction with a drain-to-source breakdown voltage of 55V and a continuous drain current of 51A at 25°C case temperature. The device exhibits a maximum on-resistance of 13.6mΩ at VGS=10V and a total gate charge of 31nC. It supports a junction operating temperature up to 175°C and allows repetitive avalanche operation.
Verify the specific package suffix required for the design: ZS corresponds to D2Pak, ZP to TO-220AB, and ZL to TO-262. Confirm lead-free status as indicated by PbF suffixes in official documentation. Check for automotive qualification requirements if applicable, as standard industrial versions are distinct from qualified variants.
Select this component for applications requiring low conduction losses and robust thermal performance up to 175°C. Ensure the gate drive circuit can handle the specified gate charge and voltage limits. Verify that the PCB layout or heatsinking meets the thermal resistance requirements for the chosen package and ambient conditions.
This part belongs to the HEXFET Power MOSFET family from Infineon Technologies (formerly International Rectifier). It is designed for industrial market applications and utilizes silicon processing techniques to optimize the balance between on-resistance and switching speed.
Direct substitutes include IRFZ46NL and IRFZ46ZLPBF. Verify pinout compatibility and electrical parameters such as RDS(on) and VGS(th) before substitution.
No, the datasheet explicitly states that the part is not recommended for use above the tested single pulse avalanche energy value.
The 'Z' suffix indicates that the device is lead-free.
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