IRG7PSH73K10PBF

Overview

The IRG7PSH73K10PBF is a high-voltage IGBT module from Infineon's PrimePACK™ 3 family, designed for industrial motor drives and power conversion. It features a half-bridge topology with integrated anti-parallel diodes in a single package. The device utilizes TRENCHSTOP™ 7 technology to optimize switching losses and conduction characteristics. Key electrical parameters include a collector-emitter voltage of 1200 V and a nominal continuous collector current of 150 A at 25°C. The module is housed in a PrimePACK™ 3 housing, providing robust thermal performance and low parasitic inductance for high-power applications.

Feature Summary

• Integrates TRENCHSTOP™ 7 IGBT and Fast Recovery Diode technologies for optimized efficiency.
• Features PrimePACK™ 3 housing design for superior thermal management and mechanical stability.
• Includes built-in negative temperature coefficient behavior for safe parallel operation.
• Offers low stray inductance layout suitable for high-frequency switching applications.

Applications

• Industrial motor drives and servo systems
• Uninterruptible power supplies (UPS)
• Induction heating equipment

Procurement Notes

Verify the specific suffix and revision level against the latest official datasheet to ensure compatibility with your system requirements. Confirm that the component meets all relevant safety and environmental standards required for your target market. Check for any obsolescence notices or recommended replacement parts if the item is no longer recommended for new designs.

Selection Notes

Select this module based on the required voltage rating of 1200 V and current capacity of 150 A. Ensure the cooling solution can handle the specified thermal resistance values under maximum load conditions. Consider the switching frequency limitations defined in the datasheet when designing the gate drive circuitry to minimize losses and electromagnetic interference.

Part Context

This component belongs to Infineon's PrimePACK™ 3 series, which is engineered for high-power density applications. The series combines advanced semiconductor chips with a standardized mechanical housing to simplify assembly and improve reliability in demanding industrial environments compared to discrete modules.

Replacement Considerations

Consult the official Infineon cross-reference guide for verified alternatives. Direct replacements must match the 1200 V rating, 150 A current class, and PrimePACK™ 3 footprint. Verify electrical parameters such as Vce(sat) and switching times to ensure equivalent performance in the existing design.