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The IS357C is an ultra-small optocoupler manufactured by Isocom Components 2004 LTD. It features a transistor output configuration with a single channel. The device provides an insulation voltage (Uinsul) of 3.75 kV (3750Vac). It is housed in a Mini-Flat-4 surface-mount package, specifically identified as SOP or 4-SMD form factor. Key electrical specifications include a collector current rating of 50 mA and a minimum Current Transfer Ratio (CTR) of 200%. This component is designed for applications requiring compact footprint and high isolation performance.
Verify the specific suffix code against the manufacturer's official datasheet to confirm pinout compatibility and CTR binning. Ensure the procurement source provides genuine components from Isocom Components 2004 LTD. Check for RoHS compliance status if required by your manufacturing standards. Confirm the package variant matches the Mini-Flat-4 specification to avoid soldering issues during assembly.
Select this component when a small SMD footprint is critical alongside standard transistor output functionality. The 3.75 kV isolation rating suits most low-voltage digital isolation needs. Consider the 200% CTR minimum for reliable switching at lower input currents. Compare physical dimensions against PCB layout constraints before finalizing the design. Ensure the operating temperature range meets the application environment requirements.
Isocom Components specializes in infrared optoelectronic devices, including optocouplers and phototransistors. The company positions its products as alternatives to common commercial standards, often providing parts no longer available from other manufacturers. The IS357C falls within their portfolio of high-performance infrared devices designed for various electronic isolation applications.
Cross-reference with equivalent 1-channel transistor output optocouplers in SOP-4 packages. Verify that substitute parts meet or exceed the 3.75 kV isolation voltage and 50 mA current ratings. Check for identical pin configurations to ensure direct board replacement without redesign.