SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The ISO106B is a hermetic, capacitive-coupled isolation buffer amplifier manufactured by Texas Instruments (originally Burr-Brown). It operates within an ambient temperature range of -25°C to +85°C and utilizes a 40-pin ceramic DIP package. The device provides a rated continuous isolation voltage of 3500 Vrms at 60Hz and withstands up to 8000 Vpk for 10 seconds. Key electrical specifications include a small-signal bandwidth of 70 kHz, a slew rate of 0.5 V/µs, and a nominal gain of 1 V/V. It features a wide input voltage range of ±10V and includes integrated ±5V DC voltage references.
Verify the specific ordering suffix 'B' against the manufacturer's datasheet to confirm the exact accuracy class and initial error specifications. Confirm that the required package type matches the 40-pin ceramic DIP format. Ensure the application environment remains within the specified operating temperature limits of -25°C to +85°C. Check for any RoHS compliance requirements as this component may be classified under older manufacturing standards.
Select the ISO106B when high-level analog signals near ±10V require precise isolation with minimal external components. This model is suitable for applications demanding superior common-mode rejection and high transient immunity. Consider the available optional gain and offset adjustment pins if factory-trimmed parameters do not meet system calibration needs. Evaluate the need for bandwidth modification using external capacitors on the designated filter pins.
The ISO106B belongs to the ISO102/ISO106 series of isolation buffer amplifiers developed by Burr-Brown, now part of Texas Instruments. These devices utilize a unique three-chip hybrid design contained within a single ceramic package. The series distinguishes itself through industry-standard dimensions and side-brazed DIP construction, facilitating automatic insertion techniques during production assembly.
The ISO102 serves as a lower isolation rating alternative within the same family. Verify pin compatibility and package dimensions before substitution. No direct modern equivalents are listed in the provided documentation.