ISO7761FDW

Overview

The ISO7761FDW is a six-channel digital isolator from Texas Instruments, housed in a 16-pin SOIC package. It features capacitive coupling for signal transmission with a maximum data rate of 100 Mb/s and a propagation delay of 11 ns. The device operates on supply voltages between 2.25 V and 5.5 V, drawing typical currents of 11.5 mA and 30.5 mA. It provides an insulation voltage of 5000 Vrms and supports unidirectional data flow. The component functions within a temperature range of -55°C to +125°C.

Feature Summary

• Provides robust electromagnetic compatibility performance suitable for noisy industrial environments
• Offers high isolation rating with capacitive coupling technology for reliable signal integrity
• Features a six-channel configuration with a 5/1 input/output polarity arrangement

Applications

• Industrial automation systems requiring galvanic isolation
• Medical equipment needing reinforced insulation barriers
• Power metering applications involving high-voltage sensing

Procurement Notes

Verify the specific suffix against official datasheets to confirm package type and tape-and-reel specifications. Ensure the component meets required insulation standards for your application safety regulations. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit products. Confirm thermal management requirements for the SOIC-16 package under maximum operating conditions.

Selection Notes

Select this component when six isolated channels are necessary within a single package footprint. Consider the 100 Mb/s data rate limit for high-speed communication needs. Evaluate the 5000 Vrms insulation capability against system voltage requirements. Compare power consumption figures with other isolators if energy efficiency is a primary design constraint.

Part Context

This device belongs to the ISO7761 series of digital isolators designed for general-purpose applications. It complements other Texas Instruments interface ICs by providing robust EMC performance. The SOIC-16 package allows for compact PCB layouts while maintaining high isolation distances. It serves as a key solution for replacing optocouplers in modern electronic designs.

Replacement Considerations

Check for direct pin-compatible alternatives within the same family that may offer different channel counts or insulation ratings. Verify that any substitute maintains the same 100 Mb/s data rate and 5000 Vrms insulation specification. Ensure the replacement package matches the SOIC-16 form factor for board compatibility.