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ISP321-2SM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 2CH TRANS 8-SMD. Review the specifications below when checking this part for your BOM.
The ISP321-2SM is a high-density, surface-mount phototransistor optically coupled isolator manufactured by Isocom Components. It features a single-channel configuration with an infrared emitting diode and an NPN silicon phototransistor. The device utilizes a plastic SOIC-8 package designed for limited space applications. Key electrical parameters include a minimum collector-emitter breakdown voltage of 70 V, a nominal current transfer ratio of 500%, and a maximum forward current of 0.05 A. It supports a maximum insulation voltage of 5300 Vrms and operates within a temperature range of -55 °C to 100 °C.
Verify the specific suffix designation against official Isocom Components documentation to confirm pinout compatibility and lead finish specifications. Ensure that the procurement source provides traceability to the manufacturer's component specification QC 88000-C003 or equivalent quality standards. Confirm that the delivered units match the exact part number to avoid functional mismatches in high-density mounting applications.
Select this component when a small form factor is required alongside robust optical isolation capabilities. The SOIC-8 package facilitates automated surface-mount assembly processes. Consider the nominal current transfer ratio and breakdown voltage requirements relative to the target circuit load. Verify thermal management needs as the plastic package dissipates heat differently than hermetically sealed ceramic alternatives.
This component belongs to the ISP321 series of high-density phototransistor optocouplers from Isocom Components. The series is characterized by its compact plastic packaging and high current transfer efficiency. It serves as a modern alternative to through-hole DIP packages in contemporary electronics manufacturing, offering similar electrical performance in a reduced footprint.
Direct replacements must maintain the SOIC-8 package, single-channel configuration, and comparable CTR specifications. Verify pin-to-pin compatibility before substitution. Generic equivalents may differ in isolation voltage ratings or operating temperature ranges.
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