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ISP321-2XSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 2CH TRANS 8-SMD. Review the specifications below when checking this part for your BOM.
The ISP321-2XSM is a high-density, surface-mount transistor output optocoupler manufactured by Isocom Components. It integrates an infrared emitting diode and an NPN silicon phototransistor within a compact SMD package. The device provides electrical isolation with a maximum insulation voltage of 5300 Vrms. It features a nominal current transfer ratio of 200% and a minimum collector-emitter breakdown voltage (BVCEO) of 35 V. The component supports a maximum forward current of 50 mA and operates across a temperature range from -55 °C to 100 °C.
Verify the specific suffix 'X' against official Isocom documentation to confirm lead form and approval status. Ensure the 'SM' designation matches the required surface mount footprint. Confirm RoHS compliance and hermetic sealing requirements if applicable to the target environment. Cross-reference datasheet revision dates to ensure parameter accuracy.
Select this component when high-density mounting is required alongside robust galvanic isolation. The specified current transfer ratio suits applications needing reliable switching performance. Verify that the package dimensions align with the PCB layout constraints. Ensure the operating temperature range meets the environmental specifications of the final assembly.
This part belongs to the ISP321 series of high-density phototransistor optically coupled isolators. The series utilizes infrared LEDs paired with NPN silicon phototransistors in plastic packages. Isocom Components manufactures these devices to meet industry standards for reliability and electrical performance in isolated signal transmission applications.
Direct replacements include other high-density surface mount phototransistor optocouplers with similar pinouts and isolation ratings. Verify compatibility regarding current transfer ratio ranges and physical package dimensions before substitution.
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