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ISP521-1GBSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 4-DIP. Review the specifications below when checking this part for your BOM.
The ISP521-1GBSM is a high-density mounting phototransistor optically coupled isolator manufactured by Isocom Components. It consists of an infrared light emitting diode and an NPN silicon photo transistor in a surface mount plastic package. The device provides electrical isolation with a maximum insulation voltage of 5300 Vrms. It features a single channel configuration with a minimum collector-emitter breakdown voltage of 35 V and a maximum forward current of 50 mA. The component is RoHS compliant and UL recognized.
Verify the specific suffix 'GBSM' against the manufacturer's official datasheet to confirm the exact lead frame material, plating specification, and tape-and-reel packaging requirements. Ensure that the procurement source provides documentation confirming UL recognition and RoHS compliance status for this specific surface mount variant. Cross-reference the pinout diagram with the target PCB footprint to prevent installation errors due to potential package variations within the series.
Select this component when a compact, surface-mount solution is required for galvanic isolation in low-power signal transmission. Consider its high density mounting capability for space-constrained designs. Evaluate the 5300 Vrms isolation rating against system safety requirements. Compare performance characteristics such as response time and current transfer ratio with alternative industry-standard equivalents if specific circuit timing or gain constraints exist.
This part belongs to the ISP521 series of high-density phototransistor optocouplers from Isocom Components. The series is designed as a replacement for standard DIP packages using surface mount technology. It shares functional similarities with other single-channel transistor output isolators but offers a reduced footprint suitable for modern automated assembly processes and dense board layouts.
Potential substitutes include TLP521-1, PC817, and SFH615A. Verify compatibility regarding pinout orientation, isolation voltage ratings, and package dimensions before implementation.
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