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The IXGT40N60C2 is a HiPerFAST C2-Class Insulated Gate Bipolar Transistor manufactured by IXYS. It features a 600V collector-emitter breakdown voltage and a continuous collector current of 75A at 25°C, with a pulsed current rating of 150A. The device utilizes a TO-268AA (D3PAK) surface-mount package and operates within a junction temperature range of -55°C to +150°C. Key electrical parameters include a maximum saturation voltage of 2.5V at 40A and a gate charge of 95nC. Switching characteristics are defined by turn-on and turn-off times of 18ns and 90ns respectively under standard test conditions.
Verify component authenticity through authorized distribution channels due to the prevalence of counterfeit semiconductor devices. Confirm that the specific suffix matches the required pinout and thermal characteristics for your PCB layout. Ensure storage conditions adhere to moisture sensitivity level requirements prior to soldering to prevent package damage during reflow processes.
Select this component when a surface-mount IGBT with 600V blocking capability and 75A continuous current rating is required. The TO-268AA package facilitates automated assembly while providing adequate thermal dissipation for moderate power levels. Consider the 2.5V saturation voltage and 95nC gate charge for efficiency calculations in high-frequency switching environments compared to legacy IGBT technologies.
This device belongs to the IXYS HiPerFAST family, specifically the C2-Class series designed for high-speed switching. It serves as a discrete power transistor alternative to modules in medium-power applications. The part number indicates a 600V rating and 40A nominal current class, though actual ratings depend on thermal management and operating conditions defined in the official datasheet.
Direct substitutes include the IXGH40N60C2 and IXGR40N60C2 from the same manufacturer. Verify pin compatibility and thermal resistance values before substitution. Cross-brand replacements require careful evaluation of Vce(sat), switching speeds, and package dimensions to ensure mechanical and electrical fit within the existing design constraints.