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The IXYH75N65C3D1 is a single N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by IXYS. It utilizes Silicon technology and features the XPT (Extreme Light Punch Through) and GenX3 technologies for optimized performance in high-frequency applications. The device is housed in a TO-247-3 package designed for through-hole mounting. Key electrical specifications include a maximum collector-emitter voltage of 650 V and a continuous collector current of 170 A at 25°C. The saturation voltage is typically 1.8 V, with a power dissipation rating of 750 W. It operates within a temperature range of -55°C to +175°C junction temperature.
Verify the specific suffix D1 against the manufacturer's latest datasheet to confirm pinout and packaging variations. Ensure that the ordering quantity aligns with the standard tube packaging configuration provided by authorized distributors. Cross-reference the RoHS compliance status with current environmental regulations before finalizing procurement orders for regulated markets.
Select this component when designing circuits requiring a balance between high current handling capacity and low switching losses. The 650V rating makes it suitable for 400V AC input systems. Consider the thermal resistance characteristics of the TO-247-3 package during heatsink selection to maintain junction temperatures within the specified 175°C limit under continuous load conditions.
This part belongs to the IXYS IXYH series of XPT IGBTs, which are engineered for general-purpose power switching applications. The series is characterized by its use of advanced trench gate technology to minimize on-state voltage drop while maintaining fast reverse recovery characteristics in the integrated anti-parallel diode. It serves as a core switching element in modern power electronics architectures.
Direct replacements may include the IXYH75N65C3 or IXYH75N65C3H1 from the same manufacturer family. Verify that substitute parts match the TO-247-3 footprint and have equivalent Vceo and Ic ratings. Always consult the specific datasheet for any differences in gate charge or thermal resistance parameters before implementing a swap.