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The IXYT90N65A5HV is a single N-channel IGBT utilizing XPT™ thin-wafer technology and Trench process. It features a collector-emitter voltage (VCES) of 650 V and a continuous collector current (IC110) of 90 A at TC = 110 °C. The saturation voltage (VCE(sat)) is 1.35 V at IC = 60 A, VGE = 15 V. Total gate charge (Qg) is 260 nC at VCE = 325 V, IC = 90 A. Thermal resistance from junction to case (RthJC) is 0.23 °C/W. Maximum junction temperature is 175 °C, with power dissipation rated at 650 W at TC = 25 °C.
Verify the component manufacturer as Littelfuse, which acquired IXYS. Confirm the datasheet revision date (XZ 12/08/2023) matches the supplied documentation. Ensure the TO-268HV package outline dimensions align with your PCB footprint requirements before finalizing orders.
Select this device for applications requiring up to 5 kHz switching frequencies. Evaluate thermal management capabilities based on the 0.23 °C/W junction-to-case resistance. Consider the 600 A pulsed collector current rating for inductive load scenarios within the specified safe operating area limits.
This component belongs to the Gen5 XPT™ IGBT family developed by Littelfuse (formerly IXYS). It represents an evolution in trench IGBT technology designed to balance conduction efficiency with switching performance for medium-frequency power conversion systems.
Direct replacements must match the 650 V / 90 A rating and TO-268HV package. Verify that alternative devices support similar VCE(sat) and Qg values to maintain existing gate drive circuit compatibility without modification.
The maximum transient gate-emitter voltage (VGEM) is ±30 V.
The collector-emitter saturation voltage increases with junction temperature, reaching approximately 1.30 V at TJ = 150 °C under standard test conditions.
The typical turn-off fall time (tfi) is 270 ns at TJ = 25 °C under inductive load conditions.