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The JANTXV1N5290-1/TR is a current regulator diode manufactured by Microchip Technology, designed for military-grade applications. It operates within a junction temperature range of -65°C to 175°C and complies with MIL-PRF-19500/463 standards. The device features a maximum anode-to-cathode voltage (Vak) of 100V and a maximum power dissipation of 500mW. It regulates current at a maximum value of 517µA with a maximum limiting voltage of 1.05V. Packaged in a DO-204AA (DO-7) axial leaded format, it is supplied in tape and reel packaging for through-hole mounting.
Verify that the specific JAN prefix and TXV suffix correspond to the required military qualification level and tolerance band. Confirm the TR suffix indicates tape and reel packaging rather than bulk. Ensure the ordering documentation explicitly references MIL-PRF-19500/463 compliance to guarantee the component meets the necessary environmental and performance standards for defense applications.
Select this component when a precise current regulation value near 517µA is required within a 100V operating window. Consider the thermal management requirements associated with the 500mW power dissipation limit. Evaluate whether the axial DO-7 package fits the mechanical constraints of the target assembly. Compare against other series members like the 1N5283-1 or 1N5314-1 if different current levels are needed.
This part belongs to the popular 1N5283-1 through 1N5314-1 series of 0.5-watt current regulators produced by Microchip. These devices offer a selection of currents ranging from 0.22 mA to 4.7 mA in standard 10% tolerances. The series is widely recognized for providing reliable current regulation in standard axial-leaded packages, offering an alternative to voltage-regulating Zener diodes in similar form factors.
Direct substitutes within the same family include the JAN1N5290-1 for lower qualification levels or the JANTX1N5290-1 for slightly relaxed specifications. Verify that any replacement maintains the 517µA nominal current and 100V maximum voltage rating. Ensure the package type remains compatible with existing PCB footprints.