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JANTXV1N6642UB2 is listed in the Single Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE STANDARD 75V 300MA UB2. Review the specifications below when checking this part for your BOM.
The JANTXV1N6642UB2 is a military-grade silicon switching diode manufactured by Microchip Technology. It features a peak reverse voltage of 75 V and a maximum forward current of 300 mA. The device exhibits a fast recovery time of 5 ns with a forward voltage of 1.2 V and a reverse current of 500 nA. Designed for surface mount installation, it utilizes the D-5D-2 package configuration. The component operates within a temperature range of -65°C to +175°C and meets JANTXV qualification standards per MIL-PRF-19500/578.
Verify that the specific suffix UB2 corresponds to the required surface mount ceramic package configuration. Confirm JANTXV qualification levels are explicitly stated on the datasheet to ensure compliance with MIL-PRF-19500/578 standards. Cross-reference the manufacturer part number against official Microchip documentation to validate electrical parameters before integration into the design.
Select this component when hermetic sealing and metallurgical bonding are required for military specifications. The surface mount UB package offers a low-profile alternative to through-hole variants while maintaining identical electrical characteristics. Ensure the circuit design accommodates the 75 V peak reverse voltage and 300 mA forward current limits for reliable operation.
This device belongs to the 1N6642 series of small-signal switching diodes. It serves as the surface mount equivalent to the popular JEDEC registered 1N6642 number. The series includes various polarities and packaging options, with the JANTXV level providing tighter parameter tolerances than standard JAN grades.
Direct substitutes include other JANTXV qualified versions within the 1N6642 family, such as JANTXV1N6642US, provided the package type matches the board layout requirements. Verify that any replacement maintains the same hermetic seal and metallurgical bond construction.
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