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The KBJ401G is a single-phase standard recovery bridge rectifier manufactured by Diodes Incorporated. It provides an average rectified output current of 4.0 A and supports a maximum repetitive peak reverse voltage of 100 V. The device features a forward voltage drop of 1.0 V at 2.0 A and a maximum reverse leakage current of 5.0 µA at rated voltage. It withstands a peak forward surge current of 120 A for an 8.3 ms half-sine wave. Operating temperatures range from -55°C to +150°C, with a typical thermal resistance of 5.5 °C/W.
Verify the specific ordering part number against official manufacturer documentation before procurement. Confirm that the component meets all required environmental standards, including RoHS compliance and lead-free finish specifications. Ensure the package type matches the intended PCB layout and mounting requirements for proper integration into the design.
Select this component when a 100 V reverse voltage rating and 4.0 A continuous current capacity are required. Consider the KBJ package dimensions and through-hole mounting style for mechanical compatibility. Evaluate the thermal resistance characteristics to ensure adequate heat dissipation in the final application environment without exceeding the maximum junction temperature limits.
This component belongs to the KBJ4005G through KBJ410G series of 4.0 A standard recovery bridge rectifiers. The series offers various voltage ratings ranging from 50 V to 1000 V while maintaining consistent current handling and physical package dimensions. This allows designers to select the appropriate voltage rating within the same footprint family for different power supply requirements.
Compatible replacements include other 4.0 A bridge rectifiers in the KBJ package with a minimum 100 V reverse voltage rating. Verify that substitute components match the forward voltage, leakage current, and surge current specifications to maintain circuit performance and reliability.
The maximum repetitive peak reverse voltage (VRRM) for the KBJ401G is 100 V.
Polarity is molded directly onto the body of the component for easy identification during assembly.
The typical thermal resistance from junction to case (RθJC) is 5.5 °C/W per element.