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The KBL400 is a single-phase silicon bridge rectifier manufactured by EIC Semiconductor Inc. It features glass passivated chips and supports a maximum repetitive peak reverse voltage of 50 V, with corresponding maximum RMS and DC blocking voltages of 35 V and 50 V respectively. The device provides a maximum average forward current of 4.0 A at an ambient temperature of 40°C and withstands a peak forward surge current of 120 A for a half-sine wave cycle. Electrical characteristics include a maximum forward voltage drop of 1.05 V per diode at 2 A, and a maximum DC reverse leakage current of 10 µA at 25°C. The component operates within a junction temperature range of -55 to +150°C.
Verify the manufacturer part number against official datasheets to confirm specifications such as voltage ratings and package dimensions. Ensure compliance with environmental directives like RoHS if required by the application. Check terminal solderability standards and polarity markings on the physical component to guarantee correct installation orientation on the printed circuit board.
Select this component based on the required peak inverse voltage and average forward current ratings for the specific circuit design. Consider the thermal resistance and operating temperature range when designing heat dissipation strategies. Verify that the surge current capability meets the transient requirements of the load to prevent device failure during startup or fault conditions.
The KBL400 belongs to the KBL series of miniature single-phase bridge rectifiers produced by EIC Semiconductor Inc. This series offers various voltage ratings ranging from 50 V to 1000 V while maintaining a consistent 4.0 A current rating. The components are designed for through-hole mounting and utilize glass passivation technology to enhance durability and electrical performance in standard rectifier applications.
Compatible substitutes include the KBL400 from Panjit International and Diodes Incorporated. These alternatives share identical electrical parameters and mechanical footprint, allowing for direct pin-to-pin replacement without modifying the printed circuit board layout or circuit design.
The maximum average forward current is 4.0 A at an ambient temperature of 40°C.
For capacitive loads, the forward current must be derated by 20% compared to resistive or inductive loads.
The typical thermal resistance from junction to ambient is 21 °C/W when mounted on a 3" x 3" copper plate.