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The GeneSiC Semiconductor KBP203 is a silicon bridge rectifier designed for through-hole mounting in the KBP package. It supports a repetitive peak reverse voltage (VRRM) of 60 V and a continuous forward current (IF) of 2 A. The device features a maximum non-repetitive surge forward current of 280 A under half-sine wave conditions. Electrical characteristics include a diode forward voltage of 1.1 V at 2 A and a reverse current of 10 µA at 50 V. Thermal resistance from junction to case is rated at 25.0 °C/W, with an operating temperature range spanning -50 °C to +150 °C.
Verify the specific voltage rating against application requirements, as the KBP203 is rated for 60 V VRRM within the KBP201-KBP204 series. Confirm package compatibility with the KBP footprint and ensure thermal management aligns with the 25.0 °C/W junction-to-case resistance. Check RoHS compliance status via manufacturer documentation before integration.
Select the KBP203 when a 60 V reverse voltage rating and 2 A continuous current are required. Compare against KBP201 (50 V) and KBP202 (100 V) for appropriate voltage headroom. Ensure the PCB layout accommodates the KBP package dimensions and built-in stand-offs for mechanical stability during operation.
The KBP203 belongs to the KBP201 through KBP204 series of silicon bridge rectifiers manufactured by GeneSiC Semiconductor. This family offers standardized ratings for low-voltage AC rectification, differentiated primarily by their repetitive peak reverse voltage capabilities ranging from 50 V to 400 V across the series.
Direct substitutes include other KBP-series bridge rectifiers with matching 60 V ratings, such as generic equivalents from manufacturers like Vishay or Littelfuse. Verify that replacement parts maintain the same 2 A current rating, KBP package outline, and thermal characteristics to ensure pinout and performance compatibility.
The KBP203 can withstand a surge non-repetitive forward current of 280 A for a half-sine wave pulse duration of 8.3 ms.
Yes, the device guarantees high-temperature soldering capability at 265°C for 10 seconds.
The thermal resistance (RthJC) from junction to case is specified as 25.0 °C/W.